EPA120B-100P updated 10/30/2006 high efficiency heterojunction power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 1 of 2 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revised november 2006 ? non-hermetic 100mil metal flange package ? +29.0dbm typical output power ? 11.5db typical power gain at 12ghz ? 0.3 x 1200 micron recessed ?mushroom? gate ? si 3 n 4 passivation ? advanced epitaxia l heterojunction profile provides extra high power efficiency and high reliability electrical characteristics (t a = 25 o c) symbols parameters/test cond itions min typ max unit 27.5 29.0 p 1db output power at 1db compression f= 12ghz v ds = 8v, i ds 50% i dss f= 18ghz 29.0 dbm 8.5 10.0 g 1db gain at 1db compression f= 12ghz v ds = 8v, i ds 50% i dss f= 18ghz 7.5 db pae power added efficiency at 1db compression v ds = 8v, i ds 50% i dss f=12ghz 41 % i dss saturated drain current v ds = 3 v, v gs = 0 v 220 360 500 ma g m transconductance v ds = 3 v, v gs = 0 v 240 380 ms v p pinch-off voltage v ds = 3 v, i ds = 3.0 ma -1.0 -2.5 v bv gd drain breakdown voltage i gd = 1.2ma -13 -15 v bv gs source breakdown voltage i gs = 1.2ma -7 -14 v r th thermal resistance (au-sn eutectic attach) 45* oc/w note: * overall rth depends on case mounting. maximum ratings at 25 o c symbols parameters absolute 1 continuous 2 v ds drain-source voltage 12v 8v v gs gate-source voltage -5v -3v igf forward gate current 5.4 ma 1.8 ma igr reverse gate current 0.9 ma 0.3 ma pin input power 26 dbm @ 3db compression tch channel temperature 175 o c 175 o c tstg storage temperature -65/175 o c -65/175 o c pt total power dissipation 3.0 w 3.0 w note: 1. exceeding any of the above ratings may result in permanent damage. 2. exceeding any of the above ratings may reduce mttf below design goals. g d
EPA120B-100P updated 10/30/2006 high efficiency heterojunction power fet specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 2 of 2 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com revised november 2006 s-parameters v ds = 8v, i ds ? i dss freq --- s11 --- --- s21 --- --- s12 --- --- s22 --- (ghz) mag ang mag ang mag ang mag ang 1 0.886 -87.71 14.3124 123. 85 0.0268 44.96 0.3521 -61.9 2 0.8246 -131.05 9.0738 94.04 0.034 23.34 0.3151 -95.01 3 0.8044 -153.2 6.4658 75.36 0.0349 12.44 0.3309 -108.22 4 0.799 -171.41 5.1003 59.46 0.0359 5.76 0.3655 -113.63 5 0.7893 172.57 4.2435 43.62 0. 0379 -2.01 0.3895 -124.84 6 0.7909 161.76 3.6494 28.44 0. 0406 -8.79 0.3918 -143.43 7 0.8063 140.89 2.8637 9.93 0.0355 -19.41 0.4602 -139.7 8 0.8116 136.41 2.6036 2.29 0.0368 -15.21 0.4581 -158.63 9 0.8801 122.73 2.377 -5.45 0. 0367 -10.55 0.5078 -168.41 10 0.7926 101.16 2.2349 -30.7 0.0431 -25.49 0.4443 176.98 11 0.812 91.02 1.8419 -42.24 0.0413 -33.63 0.4565 175.3 12 0.8336 87.7 1.6794 -51.45 0.0401 -38.6 0.4877 165.85 13 0.8641 77.96 1.5652 -64.06 0.0419 -43.75 0.4987 152.79 14 0.8396 65.1 1.3631 -78.87 0.0384 -56.18 0.4603 138.32 15 0.8301 63.19 1.3211 -91.22 0.0445 -60.12 0.4783 126.33 16 0.7396 51.8 1.2456 -109.53 0.0468 -75.93 0.4736 111.28 17 0.5725 14.55 0.8638 -120.63 0.0354 -88.27 0.4301 107.19 18 0.7069 36.37 1.248 -115.65 0.0638 -73.92 0.4973 102.65 19 0.8117 26.29 0.9867 -135.45 0.0589 -89.54 0.4262 102.14 20 0.7054 31.13 1.2335 -144.82 0.0785 -91.84 0.4747 108.44 21 0.5985 17.39 1.1556 -170.66 0.0846 -113.27 0.4305 78.98 22 0.7824 -20.53 1.0851 176.01 0.0789 -119.91 0.3756 41.47 23 0.8254 -26.89 1.1022 165.7 0.0915 -129.87 0.3377 33.6 24 0.695 -58.7 1.2817 139.97 0.121 -155.16 0.2897 22.05 25 0.7224 -96.71 1.1194 111.93 0.1192 177.47 0.2786 -38.09 26 0.8361 -85.49 0.9954 98. 91 0.1157 166.16 0.3616 -77.2 disclaimer excelics semiconductor reserves the right to m ake changes without further notice to any products herein to improve reliability, function or design. excelics does not assume any liability arising out of the application or use of any product or circuit described herein. life support policy excelics semiconductor products are not authoriz ed for use as critical components in life support devices or systems without the express written approval of excelics semiconductor, inc. as here in: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perf orm when properly used in accordance with instructions for use provided in the labeling, can be reasonably expect ed to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support dev ice or system, or to affect its safety or effectiveness
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